What is Hot Air Leveling?
Hot air solder leveling (HASL) is a process whereby solder is applied to the exposed copper surfaces of a printed circuit board by immersing the board in molten solder and then blowing high pressure, heated air across the board as it is removed from the solder.
Vertical hot air leveling has been refined and improved to the point that it now produces the best solder surface required for today's PCBs.
Browse through our web site and find out why Avalon Products is the best choice for Hot Air Leveling...
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